ENGLISH

3D Microelectronic Packaging: From Architectures to Applications

By Yan Li , Deepak Goyal

Book information

Publisher
Springer Singapore;Springer
Year
2021
ISBN
9789811570896, 9789811570902
DOI
10.1007/978-981-15-7090-2
Language
english
Format
PDF
Filesize
35 MB (37160898 bytes)
Series
Springer Series in Advanced Microelectronics 64
Edition
2nd ed.
Pages
XVII, 622\629
Time added
2021-01-06 05:41:07
Instrumentation; Optical and Electronic Materials;Physics; Electronic Circuits and Devices; Electron

Description

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

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