ENGLISH

Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics)

By Jan A. Dziuban

Book information

Year
2006
ISBN
1402045786, 9781402045899, 9781402045783
Open Library ID
OL9547495M
Language
english
Format
PDF
Filesize
21 MB (21817334 bytes)
Edition
1
Pages
349\345
Scanned
yes
Time added
2011-06-04 13:46:07
Приборостроение;Микро- и наносистемная техника

Description

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

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