Handbook of Wafer Bonding

Description

Wiley-VCH, 2012. - 425 p.The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding.Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.Table of ContentsAdhesive and Anodic Bonding Glass Frit Wafer Bonding Wafer Bonding Using Spin-On Glass as Bonding Material Polymer Adhesive Wafer Bonding Anodic Bonding Direct Wafer Bonding Direct Wafer Bonding Plasma-Activated Bonding Metal Bonding Au/Sn Solder Eutectic Au-In Bonding Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers Wafer-Level Solid-Liquid Interdiffusion Bonding Hybrid Metal/Dielectric Bonding Hybrid Metal/Polymer Wafer Bonding Platform Cu/SiO2 Hybrid Bonding Metal/Silicon Oxide Hybrid Bonding Microelectromechanical Systems Three-Dimensional Integration Temporary Bonding for Enabling Three-Dimensional Integration and Packaging Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems Thin Wafer Support System for above 250°C Processing and Cold De-bonding Temporary Bonding: Electrostatic