ENGLISH

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

By Thomas R. Bieler , Choong-Un Kim , Tae-Kyu Lee , Hongtao Ma (auth.)

Book information

Publisher
Springer US
Year
2015
ISBN
978-1-4614-9265-8, 978-1-4614-9266-5
DOI
10.1007/978-1-4614-9266-5
Language
english
Format
PDF
Filesize
15 MB (15886545 bytes)
Edition
1
Pages
253\266
Time added
2014-11-10 20:00:00
Electronics and MicroelectronicsInstrumentation; Optical and Electronic Materials;

Description

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

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