Power Integrity Modeling and Design for Semiconductors and Systems (Prentice Hall Modern Semiconductor Design)

Description

The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems. Cover Contents Preface Acknowledgments About the Authors Chapter 1 Basic Concepts 1.1 Introduction 1.1.1 Functioning of Transistors 1.1.2 What Are the Problems with Power Delivery? 1.1.3 Importance of Power Delivery in Microprocessors and ICs 1.1.4 Power Delivery Network 1.1.5 Transients on the Power Supply 1.2 Simple Relationships for Power Delivery 1.2.1 Core Circuits 1.2.2 I/O Circuits 1.2.3 Delay Due to SSN 1.2.4 Timing and Voltage Margin Due to SSN 1.2.5 Relationship between Capacitor and Current 1.3 Design of PDNs 1.3.1 Target Impedance 1.3.2 Impedance and Noise Voltage 1.4 Components of a PDN 1.4.1 Voltage Regulator 1.4.2 Bypass or Decoupling Capacitors 1.4.3 Package and Board Planes 1.4.4 On-Chip Power Distribution 1.4.5 PDN with Components 1.5 Analysis of PDNs 1.5.1 Single-Node Analysis 1.5.2 Distributed Analysis 1.6 Chip-Package Antiresonance: An Example 1.7 High-Frequency Measurements 1.7.1 Measurement of Impedance 1.7.2 Measurement of Self-Impedance 1.7.3 Measurement of Transfer Impedance 1.7.4 Measurement of Impedance by Completely Eliminating Probe Inductance 1.8 Signal Lines Referenced to Planes 1.8.1 Signal Lines as Transmission Lines 1.8.2 Relationship between Transmission-Line Parameters and SSN 1.8.3 Relationship between SSN and Return Path Discontinuities 1.9 PDN Modeling Methodology 1.10 Summary Chapter 2 Modeling of Planes 2.1 Introduction 2.2 Behavior of Planes 2.2.1 Frequency Domain 2.2.2 Time Domain 2.2.3 Two-Dimensional Planes 2.3 Lumped Modeling Using Partial Inductances 2.3.1 Extracting the Inductance and Resistance Matrices 2.4 Distributed Circuit-Based Approaches 2.4.1 Modeling Using Transmission Lines 2.4.2 Transmission Matrix Method (TMM) 2.4.3 Frequency-Dependent Behavior of Unit-Cell Elements 2.4.4 Modeling of Gaps in Planes 2.5 Discretization-Based Plane Models 2.5.1 Finite-Difference Method 2.5.2 Finite-Difference Time-Domain Method 2.5.3 Finite-Element Method 2.6 Analytical Methods 2.6.1 Cavity Resonator Method 2.6.2 Network Representation of the Cavity Resonator Model 2.7 Multiple Plane Pairs 2.7.1 Coupling through the Vias 2.7.2 Coupling through the Conductors 2.7.3 Coupling through the Apertures 2.8 Summary Chapter 3 Simultaneous Switching Noise 3.1 Introduction 3.1.1 Methods for Modeling SSN 3.2 Simple Models 3.2.1 Modeling of Output Buffers 3.3 Modeling of Transmission Lines and Planes 3.3.1 Microstrip Configuration 3.3.2 Stripline Configuration 3.3.3 Conductor-Backed Coplanar Waveguide Configuration 3.3.4 Summary of Modal Decomposition Methods 3.4 Application of Models in Time-Domain Analysis 3.4.1 Plane Bounce from Return Currents 3.4.2 Microstrip-to-Microstrip Via Transition 3.4.3 Split Planes 3.5 Application of Models in Frequency-Domain Analysis 3.5.1 Stripline between a Power and a Ground Plane 3.5.2 Microstrip-to-Stripline Via Transition 3.5.3 Reduction of Noise Coupling Using Thin Dielectrics 3.6 Extension of M-FDM to Incorporate Transmission Lines 3.6.1 Analysis of a Complex Board Design 3.7 Summary Chapter 4 Time-Domain Simulation Methods 4.1 Introduction 4.2 Rational Function Method 4.2.1 Basic Theory 4.2.2 Interpolation Schemes 4.2.3 Properties of Rational Functions 4.2.4 Passivity Enforcement 4.2.5 Integration in a Circuit Solver 4.2.6 Disadvantages 4.3 Signal Flow Graphs 4.3.1 Causality 4.3.2 Transfer-Function Causality 4.3.3 Minimum Phase 4.3.4 Delay Extraction from Frequency Response 4.3.5 Causal Signal Flow Graphs 4.3.6 Computational Aspects in SFG 4.3.7 Fast Convolution Methods 4.3.8 Cosimulation of Signal and Power Using SFGs 4.4 Modified Nodal Analysis (MNA) 4.4.1 What Is MNA? 4.4.2 Frequency Domain 4.4.3 Time Domain 4.4.4 MNA Formulation with S-Parameters 4.5 Summary Chapter 5 Applications 5.1 Introduction 5.2 High-Speed Servers 5.2.1 Core PDN Noise 5.2.2 I/O PDN Noise 5.2.3 Summary 5.3 High-Speed Differential Signaling 5.3.1 Test Vehicle Description 5.3.2 Plane Modeling 5.3.3 Modeling of Master and Slave Islands 5.3.4 Rational Function Modeling 5.3.5 Modal Decomposition and Noise Simulation 5.3.6 Summary 5.4 Analysis of IC Packages 5.4.1 Simulation of a Multilayered Package Using M-FDM 5.4.2 Causal Simulation of HyperBGA Package 5.4.3 Summary 5.5 Extraction of Dielectric Constant and Loss Tangent 5.5.1 Problem Definition 5.5.2 Corner-to-Corner Plane-Probing Method 5.5.3 Causal Model Development 5.5.4 Summary 5.6 Embedded Decoupling Capacitors 5.6.1 Embedded Individual Thin- or Thick-Film Capacitors 5.6.2 Why Embed Individual Capacitors 5.6.3 Design of an Embedded Thick-Film Capacitor Array 5.6.4 Integration of Embedded Capacitors into IBM Package 5.6.5 Embedded Planar Capacitors 5.6.6 Summary 5.7 Electromagnetic Bandgap (EBG) Structures 5.7.1 Basic Theory 5.7.2 Response of EBG Structures 5.7.3 Dispersion-Diagram Analysis 5.7.4 Modification of M-FDM Using Fringe and Gap Fields 5.7.5 Scalable Design of EBG Structures for Power Plane Isolation 5.7.6 Digital–RF Integration 5.7.7 ADC Load-Board Design 5.7.8 Issues with EBG Structures for Digital Systems 5.7.9 Summary 5.8 Future Challenges Appendix A A.1 Multiport Networks A.2 Matrix Representation of Transmission Lines A.3 Spectrum of Digital Signals Appendix B: Software list Index A B C D E F G H I J K L M N O P Q R S T V W X Y