ENGLISH

Design and Modeling for 3DICs and Interposers

By Madhavan Swaminathan , Ki Jin Han

Book information

Publisher
World Scientific Publishing Company
Year
2014
ISBN
9814508594, 9789814508599
Language
english
Format
PDF
Filesize
34 MB (36115606 bytes)
Series
Wspc Series in Advanced Integration and Packaging
Pages
380\379
Scanned
yes
Time added
2015-07-21 21:58:01
Design Circuits Electrical Electronics Engineering

Description

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution. Readership: Graduate students, academics, researchers in electrical and electronics engineering, computer engineering, semiconductors and packaging.

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