ENGLISH

Low Dielectric Constant Materials for IC Applications

By P. S. Ho , J. Leu , W. W. Lee (auth.) , Professor Paul S. Ho , Jihperng Jim Leu , Wei William Lee (eds.)

Book information

Publisher
Springer-Verlag Berlin Heidelberg
Year
2003
ISBN
978-3-642-63221-1, 978-3-642-55908-2
DOI
10.1007/978-3-642-55908-2
Language
english
Format
PDF
Filesize
5 MB (5475745 bytes)
Series
Springer Series in Advanced Microelectronics 9
Edition
1
Pages
310\322
Orientation
yes
Scanned
yes
Time added
2013-08-01 04:00:00
InstrumentationOptical and Electronic Materials; Characterization

Description

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

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