ENGLISH

Electromigration in Thin Films and Electronic Devices: Materials and Reliability

By Choong-Un Kim

Book information

Publisher
Woodhead Publishing
Year
2011
ISBN
1845699378, 9781845699376
Open Library ID
OL25214345M
Language
english
Format
PDF
Filesize
7 MB (7038920 bytes)
Pages
345\345
Orientation
no
Scanned
yes
Time added
2012-02-04 16:00:00
Приборостроение;Полупроводниковые приборы

Description

Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area. Part one consists of three introductory chapters, covering modeling of electromigration phenomena, modeling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.

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