ENGLISH

Structural Analysis of Printed Circuit Board Systems

By Peter A. Engel (auth.)

Book information

Publisher
Springer-Verlag New York
Year
1993
ISBN
978-1-4612-6945-8, 978-1-4612-0915-7
DOI
10.1007/978-1-4612-0915-7
Language
english
Format
PDF
Filesize
20 MB (20858100 bytes)
Series
Mechanical Engineering Series
Edition
1
Pages
291\306
Orientation
yes
Scanned
yes
Time added
2013-08-01 04:00:00
InstrumentationMechanics;Characterization and Evaluation of Mater

Description

This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.

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