Circadian Rhythms for Future Resilient Electronic Systems: Accelerated Active Self-Healing for Integrated Circuits

Description

This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware;Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow;Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems;Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both;Includes coverage of resilient aspects of emerging applications such as IoT. Front Matter ....Pages i-xix Front Matter ....Pages 1-1 Introduction to Wearout (Xinfei Guo, Mircea R. Stan)....Pages 3-14 Front Matter ....Pages 15-15 Accelerated and Active Self-healing Techniques for BTI Wearout (Xinfei Guo, Mircea R. Stan)....Pages 17-55 Accelerating and Activating Recovery Against EM Wearout (Xinfei Guo, Mircea R. Stan)....Pages 57-75 Front Matter ....Pages 77-77 Circuit Techniques for BTI and EM Accelerated and Active Recovery (Xinfei Guo, Mircea R. Stan)....Pages 79-120 Active Accelerated Self-healing as a Key Design Knob for Cross-Layer Resilience (Xinfei Guo, Mircea R. Stan)....Pages 121-139 Front Matter ....Pages 141-141 Design and Aging Challenges in FinFET Circuits and Internet of Things (IoT) Applications (Xinfei Guo, Mircea R. Stan)....Pages 143-189 Front Matter ....Pages 191-191 Future Directions in Self-healing (Xinfei Guo, Mircea R. Stan)....Pages 193-197 Back Matter ....Pages 199-208