ENGLISH

Materials for Advanced Packaging

By Daniel Lu , C.P. Wong (eds.)

Book information

Publisher
Springer
Year
2016
ISBN
3319450972, 9783319450971
DOI
10.1007/978-3-319-45098-8
Language
english
Format
PDF
Filesize
43 MB (45482019 bytes)
Edition
2
Pages
969\974
Time added
2016-11-30 22:31:00
Electronics and MicroelectronicsInstrumentation;Nanotechnology and Microengineerin

Description

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

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