ENGLISH

Rapid Thermal Processing of Semiconductors

Book information

Publisher
Springer US
Year
1997
ISBN
978-1-4899-1806-2, 978-1-4899-1804-8
DOI
10.1007/978-1-4899-1804-8
Language
english
Format
PDF
Filesize
15 MB (15902532 bytes)
Series
Microdevices
Edition
1
Pages
358\374
Time added
2014-01-18 08:00:00

Description

Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.

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