Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

Description

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Front Matter ....Pages i-x Introduction (Farhang Yazdani)....Pages 1-12 Wirebond Physical Implementation (Farhang Yazdani)....Pages 13-25 Flip Chip Physical Implementation (Farhang Yazdani)....Pages 27-37 Substrate Physical Implementation (Farhang Yazdani)....Pages 39-52 Conventional Design Flow (Farhang Yazdani)....Pages 53-111 Pathfinding and Co-design (Farhang Yazdani)....Pages 113-173 Back Matter ....Pages 175-177