ENGLISH

Through silicon vias: materials, models, design, and performance

By Brajesh Kumar Kaushik , Vobulapuram Ramesh Kumar , Manoj Kumar Majumder , Arsalan Alam

Book information

Publisher
CRC Press
Year
2017
ISBN
978-1-4987-4552-9, 1498745520, 9781498745536, 1498745539
Language
english
Format
PDF
Filesize
8 MB (8126043 bytes)
Pages
215\232
Time added
2017-01-21 08:00:00
Interconnects (Integrated circuit technology);Thre

Description

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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