Contactless VLSI Measurement and Testing Techniques

Description

This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing. The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test. Front Matter ....Pages i-v Conventional Test Methods (Selahattin Sayil)....Pages 1-7 Testability Design (Selahattin Sayil)....Pages 9-15 Other Techniques Based on the Contacting Probe (Selahattin Sayil)....Pages 17-24 Contactless Testing (Selahattin Sayil)....Pages 25-31 Electron Beam and Photoemission Probing (Selahattin Sayil)....Pages 33-41 Electro-Optic Sampling and Charge-Density Probe (Selahattin Sayil)....Pages 43-54 Electric Force Microscope, Capacitive Coupling, and Scanning Magnetoresistive Probe (Selahattin Sayil)....Pages 55-59 Probing Techniques Based on Light Emission from Chip (Selahattin Sayil)....Pages 61-66 All-Silicon Optical Technology for Contactless Testing of Integrated Circuits (Selahattin Sayil)....Pages 67-83 Comparison of Contactless Testing Methodologies (Selahattin Sayil)....Pages 85-93