ENGLISH

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

By Ibrahim (Abe) M. Elfadel , Gerhard Fettweis (eds.)

Book information

Publisher
Springer International Publishing
Year
2016
ISBN
978-3-319-20480-2, 978-3-319-20481-9
DOI
10.1007/978-3-319-20481-9
Language
english
Format
PDF
Filesize
16 MB (17124852 bytes)
Edition
1
Pages
XXIII, 339\354
Time added
2016-07-20 04:00:00
Circuits and Systems; Electronic Circuits and Devi

Description

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

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