Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly and applications for injection molded circuit carriers

Book information

Publisher

Hanser Gardner Pubns, Elsevier Inc

Year

2013

ISBN

978-1-56990-551-7, 978-1-56990-552-4, 1569905517, 1569905525

Language

english

Format

PDF

Filesize

15 MB (15252149 bytes)

Pages

XII, 356 S. : Ill., graph. Darst\362

Topic

Chemistry › Chemical

Time added

2014-11-04 21:00:00