ENGLISH

Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications

By Kenji Takahashi (eds.) , Kazuo Kondo , Morihiro Kada

Book information

Publisher
Springer International Publishing
Year
2015
ISBN
978-3-319-18674-0, 978-3-319-18675-7
DOI
10.1007/978-3-319-18675-7
Language
english
Format
PDF
Filesize
43 MB (45129797 bytes)
Edition
1
Pages
XIX, 408\423
Time added
2016-03-14 21:35:01
Electrochemistry; Electrical Engineering; Semicond

Description

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

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