Design of Adhesive Joints Under Humid Conditions

Description

This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increase in numerical computing power there have been attempts to formalize the different environmental contributions in order to provide a procedure to predict assembly durability, based on an initial identification of diffusion coefficients and mechanical parameters for both the adhesive and the interface. A coupled numerical model for the joint of interest is then constructed and this allows local water content to be defined and resulting changes in adhesive and interface properties to be predicted. Front Matter....Pages i-vii Diffusion of Water in Adhesives....Pages 1-19 Water and Ions at Polymer/Metal Interfaces....Pages 21-52 Surface Treatments for Moisture Resistance....Pages 53-76 Influences of Water on the Adhesive Properties....Pages 77-94 Influence of Water on the Interface Properties....Pages 95-111 Prediction of Adhesion Strength for IC Plastic Package Under Humid Conditions—Fracture Mechanics Approach....Pages 113-121 Prediction of Joint Strength Under Humid Conditions: Damage Mechanics Approach....Pages 123-146 Prediction of Joint Strength Under Humid Conditions with Cyclic Loading....Pages 147-182