ENGLISH

Area Array Packaging Handbook: Manufacturing and Assembly

By Ken Gilleo

Book information

Publisher
McGraw-Hill Professional
Year
2001
ISBN
0071374930, 9780071374934
Open Library ID
OL18168308M
Language
english
Format
DJVU
Filesize
14 MB (15003371 bytes)
Edition
1
Pages
782\782
DPI
300
Time added
2011-01-23 12:00:00

Description

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

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