ENGLISH

Nanopackaging: Nanotechnologies and Electronics Packaging

By James E. Morris

Book information

Publisher
Springer
Year
2008
ISBN
0387473254, 9780387473253, 9780387473260
Open Library ID
OL10152870M
Language
english
Format
PDF
Filesize
14 MB (14815254 bytes)
Edition
1
Pages
553\553
Library
NanoScience
Time added
2010-02-18 13:16:04
Специальные дисциплины;Наноматериалы и нанотехноло

Description

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.

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