Spacecraft Thermal Control Handbook: Fundamental Technologies

Description

This new edition of the classic Satellite Thermal Control Handbook, is a thorough, technical survey of the various technologies used to achieve thermal control of all types of spacecraft, as well as the design and analysis methods used by thermal engineers. Features: Spacecraft Systems Overview; Spacecraft Thermal Environments; Thermal Design Examples; Thermal Surface Finishes; Insulation; Radiators; Heaters; Mounting and Interfaces; Louvers; Heat Switches; Phase Change Materials; Pumped Fluid Loops; Thermoelectric Coolers; Heat Pipes; Thermal Design Analysis; Thermal Contact Resistance; Precision Temperature Control; Space Shuttle Integration; Thermal Testing; Future Technologies Cover......Page 1 Spacecraft Thermal Control Handbook
Volume I: Fundamental Technologies......Page 2 ISBN 9781884989117......Page 3 Preface......Page 4 Table of Contents......Page 10 1.2 Spacecraft Configurations......Page 15 1.3 Earth Orbits......Page 21 1.4 Interplanetary Orbits......Page 25 1.5 Missions......Page 29 2.1 Environments of Earth Orbit......Page 35 2.2 Standard Earth Orbits......Page 50 2.3 Environments of Interplanetary Missions......Page 62 2.4 Aerobraking Environments......Page 74 2.5 Launch and Ascent Environments......Page 77 2.6 References......Page 81 3.2 Spin-Stabilized Satellites......Page 84 3.3 Three-Axis-Stabilized Satellites......Page 85 3.4 Propulsion Systems......Page 86 3.5 Batteries......Page 90 3.6 Antennas......Page 92 3.7 Sun, Earth, and Star Sensors......Page 94 3.8 Cooled Devices......Page 97 3.9 Solar Arrays......Page 99 3.10 The Huygens Probe......Page 100 3.11 System Overview: The Hubble Space Telescope......Page 108 4.2 Common Thermal Surface Finishes......Page 151 4.3 Causes of Thermal Surface Degradation......Page 155 4.4 Degradation Rates for Common Thermal Finishes......Page 164 4.5 LDEF Results......Page 167 4.6 Electrical Grounding......Page 170 4.7 References......Page 171 5.1 Introduction......Page 172 5.2 Blanket Performance......Page 173 5.4 Materials......Page 180 5.5 Provisions for Venting......Page 193 5.6 Attachments......Page 194 5.7 Provisions for Electrical Grounding......Page 197 5.8 Fabrication......Page 198 5.10 High-Temperature Blankets......Page 204 5.11 Suggestions......Page 205 5.12 Insulation for In-Atmosphere Applications......Page 209 5.13 References......Page 216 6.1 Introduction......Page 217 6.4 Body-Mounted Radiators......Page 219 6.5 Deployable Radiators......Page 221 6.6 Radiator Freezing......Page 225 6.7 Radiator Effectiveness......Page 227 6.8 Experimental Radiators......Page 230 6.9 References......Page 232 7.2 Heater Types......Page 233 7.3 Control......Page 234 7.4 Failure Modes of Mechanical Thermostats......Page 237 7.5 Circuits......Page 238 7.6 Computer-Controlled Heater System Example......Page 241 7.7 Radioisotope Heater Units......Page 251 8.2 Unit Conduction Cooling......Page 256 8.3 Bolted-Joint Conductance without Interface Filler......Page 269 8.4 Bolted-Joint Conductance with Interface Filler......Page 284 8.5 Complex Configurations and Special Topics......Page 293 8.6 Nomenclature......Page 329 8.7 References......Page 332 9.1 Introduction......Page 339 9.2 Vane Louvers......Page 340 9.3 Analysis of Vane Louvers......Page 343 9.4 Designing Louvers for Operation in Sunlight......Page 354 9.5 Pinwheel Louvers......Page 357 9.6 References......Page 360 10.1 Introduction......Page 361 10.2 Heat-Switch Applications......Page 362 10.3 Heat-Switch Integration......Page 363 10.4 Paraffin Heat Switches......Page 365 10.5 Cryogenic Heat Switches......Page 374 10.6 References......Page 378 11.1 Phase-Change-Material Applications......Page 380 11.2 Phase-Change Materials......Page 384 11.3 When To Use a PCM......Page 387 11.4 PCM Design Details......Page 390 11.6 References......Page 409 12.1 Introduction......Page 411 12.2 Fluid-Flow Concepts and Basic Equations......Page 413 12.3 Forced Convection in Pipes and Tubes......Page 421 12.4 System Hardware......Page 424 12.5 Analysis of a Fluid Loop......Page 448 12.6 Computer Software for System Analysis......Page 449 12.7 PFL Application......Page 450 12.8 References......Page 474 13.2 Background......Page 479 13.3 Characteristics......Page 481 13.4 Optimizations......Page 482 13.6 Interfaces......Page 484 13.7 XRT Focal-Plane TEC Mounting......Page 485 13.8 Design Development......Page 486 13.10 Application Example......Page 487 13.11 Reference......Page 493 14.1 Overview......Page 494 14.2 Types of Heat Pipe......Page 495 14.3 Analysis......Page 501 14.4 Testing......Page 505 14.5 Heat-Pipe Applications and Performance......Page 506 14.7 LHPs and CPLs......Page 507 14.8 Selecting a Design......Page 523 14.9 References......Page 526 15.2 Spacecraft Project Phases......Page 528 15.3 Thermal Design/Analysis Process Overview......Page 539 15.4 Fundamentals of Thermal Modeling......Page 542 15.5 Thermal Design Analysis Example: POAM......Page 557 15.6 Margins......Page 577 15.7 TMM Computer Codes......Page 580 15.8 Radiation Analysis Codes......Page 597 15.9 References......Page 602 16.1 Introduction......Page 604 16.2 Contact Heat-Transfer Background......Page 605 16.3 Parameters Influencing Thermal Joint Resistance......Page 607 16.4 Thermal Joint Resistance Models......Page 608 16.5 The Effect of Oxidation on Thermal Contact Resistance......Page 628 16.6 The Effect of Interstitial Materials on Thermal Contact Resistance......Page 631 16.7 References......Page 641 17.1 Introduction......Page 644 17.2 The Space Interferometry Mission......Page 645 17.3 The Hydrogen Maser Clock......Page 660 17.5 References......Page 671 18.1 Introduction......Page 672 18.2 Engineering-Compatibility Assessment......Page 674 18.3 Safety Assessment......Page 680 18.4 The Cargo Integration Review......Page 681 18.5 Orbiter Payload-Bay Thermal Environment......Page 682 18.6 Middeck Payload Accommodations......Page 702 18.7 Ferry-Flight Accommodations......Page 705 18.8 Optional Services......Page 706 19.1 Introduction......Page 714 19.2 Definitions......Page 715 19.3 Design Environments......Page 720 19.4 Development Thermal Testing......Page 730 19.5 Unit Thermal Testing......Page 732 19.7 System Thermal Testing......Page 747 19.8 Launch Site Thermal Testing......Page 761 19.9 References......Page 762 20.1 Introduction......Page 763 20.2 Technology Drivers......Page 764 20.4 Future Technologies and Innovations......Page 765 20.5 Summary......Page 790 20.6 References......Page 791 Appendix A: Surface Optical Property Data......Page 794 Appendix B: Material Thermal Properties......Page 805 Appendix C: Thermally Conductive Filler Materials and Suppliers......Page 821 C......Page 832 H......Page 833 M......Page 834 S......Page 835 T......Page 836 W......Page 837