ENGLISH

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

By Yong Liu (auth.)

Book information

Publisher
Springer-Verlag New York
Year
2012
ISBN
9781461410539, 1461410533
DOI
10.1007/978-1-4614-1053-9
Language
english
Format
PDF
Filesize
26 MB (27377290 bytes)
Edition
1
Pages
594\605
Library
usenet tech
Time added
2013-03-30 20:00:00
Electrical Machines and Networks;Electronics and MInstrumentation;Solid State Physics;Spectroscopy aPower Electronics

Description

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly, reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each tasks unique characteristics.

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