ENGLISH

Optical Interconnects

Book information

Publisher
Morgan and Claypool Publishers
Year
2006
ISBN
1598290665, 9781598290660
DOI
10.2200/S00029ED1V01Y200605SSM002
Open Library ID
OL8898876M
Language
english
Format
PDF
Filesize
11 MB (11938862 bytes)
Series
Synthesis Lectures on Solid State Materials and Devices
Pages
104\104
Library
Kingdwarf
Time added
2010-01-07 06:59:20

Description

This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.

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