Printed circuits handbook

Description

CD-ROM includes: copies of the text by part and then by chapters. Abstract: CD-ROM includes: copies of the text by part and then by chapters Content: PART 1: INTRODUCTION TO PRINTED CIRCUITS. Chapter 1: Electronic Packaging and High-Density Interconnectivity -- Chapter 2: Semiconductor Packaging Technology -- Chapter 3: Advanced Packaging -- Chapter 4: Types of Printed Wiring Boards -- PART 2: MATERIALS. Chapter 5: Introduction to Base Materials -- Chapter 6: Base Material Components -- Chapter 7: Base Material Manufacturing Processes -- Chapter 8: Properties of Base Materials -- Chapter 9: Densification Issues for Base Materials -- Chapter 10: Introducing Base Materials into the PCB Manufacturing Process -- Chapter 11: HDI Microvia Materials -- Chapter 12: Laminate Qualification and Testing -- PART 3: ENGINEERING AND DESIGN. Chapter 13: Physical Characteristics of PCB -- Chapter 14: The PCB Design Process -- Chapter 15: Electrical and Mechanical Design Parameters -- Chapter 16: Controlled Impedance -- Chapter 17: Multilayer Design Issues -- Chapter 18: Planning for Design, Fabrication, and Assembly -- Chapter 19: Manufacturing Information Documentation and Transfer -- Chapter 20: Electronic Contract Manufacturing Supplier Selection and Management -- PART 4: HIGH-DENSITY INTERCONNECT. Chapter 21: Introduction to High-Density Interconnection Technology -- Chapter 22: High-Density Interconnect-Build-up Technologies -- Chapter 23: Microvia Hole Technologies -- PART 5: FABRICATION PROCESSES. Chapter 24. Drilling Processes -- Chapter 25. High-Density Interconnect Drilling -- Chapter 26. Imaging -- Chapter 27. Multilayer Materials and Processing -- Chapter 28. Preparing Boards for Plating -- Chapter 29. Electroplating -- Chapter 30. Direct Plating -- hapter 39. Bare Board Test Equipment -- Chapter 40. HDI Bare Board Special Testing Methods -- PART 6: ASSEMBLY. Chapter 41. Assembly Processes -- PART 7: SOLDERING. Chapter 42. Design for Soldering and Solderability -- Chapter 43. Solder Materials and Processes -- Chapter 44. No-Clean Assembly Process -- Chapter 45. Lead-Free Soldering -- Chapter 46. Fluxes and Cleaning -- Chapter 47. Press-Fit Connections -- PART 8: QUALITY CONTROL AND RELIABILITY -- Chapter 48. Acceptability of Fabricated Boards -- Chapter 49. Acceptability of Printed Circuit Board Assemblies -- Chapter 50. Assembly Inspection -- Chapter 51. Design for Testing -- Chapter 52. Loaded Board Testing -- Chapter 53. Reliability of Printed Circuit Assemblies -- Chapter 54. Component-to-PWB Reliability -- PART 9: ENVIRONMENTAL ISSUES AND WASTE TREATMENT. Chapter 55. Process Waste Minimization and Treatment -- PART 10: FLEXIBLE CIRCUITS. Chapter 56. Flexible Circuits: Applications and Materials -- Chapter 57. Design of Flexible Circuits -- Chapter 58. Manufacturing of Flexible Circuits -- Chapter 59. Termination of Flexible Circuits -- Chapter 60. Special Constructions of Flexible Circuits -- Chapter 61. Quality Assurance of Flexible Circuits -- Appendix. Chapter 31. PWB Manufacture Using Fully Electroless Copper -- Chapter 32. Surface Finishes -- Chapter 33. Etching Process and Technologies -- Chapter 34. Solder Resist Material and Processes -- Chapter 35. Machining and Routing -- Chapter 36. Process Capability and Control -- Chapter 37. Bare Board Test Objectives and Definitions -- Chapter 38. Bare Board Test Methods -- Chapter 39. Bare Board Test Equipment -- Chapter 40. HDI Bare Board Special Testing Methods -- PART 6: ASSEMBLY. Chapter 41. Assembly Processes -- PART 7: SOLDERING. Chapter 42. Design for Soldering and Solderability -- Chapter 43. Solder Materials and Processes -- Chapter 44. No-Clean Assembly Process -- Chapter 45. Lead-Free Soldering -- Chapter 46. Fluxes and Cleaning -- Chapter 47. Press-Fit Connections -- PART 8: QUALITY CONTROL AND RELIABILITY -- Chapter 48. Acceptability of Fabricated Boards -- Chapter 49. Acceptability of Printed Circuit Board Assemblies -- Chapter 50. Assembly Inspection -- Chapter 51. Design for Testing -- Chapter 52. Loaded Board Testing -- Chapter 53. Reliability of Printed Circuit Assemblies -- Chapter 54. Component-to-PWB Reliability -- PART 9: ENVIRONMENTAL ISSUES AND WASTE TREATMENT. Chapter 55. Process Waste Minimization and Treatment -- PART 10: FLEXIBLE CIRCUITS. Chapter 56. Flexible Circuits: Applications and Materials -- Chapter 57. Design of Flexible Circuits -- Chapter 58. Manufacturing of Flexible Circuits -- Chapter 59. Termination of Flexible Circuits -- Chapter 60. Special Constructions of Flexible Circuits -- Chapter 61. Quality Assurance of Flexible Circuits -- Appendix.