From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications

Description

A comprehensive reference including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field • An introductory/intermediate level treatment including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field • The authors lead a LED packaging R&D center with an industrial grade prototyping line and state-of-the-art facilities for materials/optical/electrical/thermal characterization. A substantial amount of technical contents in this book is based on the hands-on experience and experimental practices of the authors • The manufacture of LED-based luminaries for lighting is a huge area and there is a need for a comprehensive book instructing engineers and designers in the lighting industry • Includes packaging LED components such as interconnection, phosphor deposition, encapsulation, thermal management and reliability, making this an excellent reference and background reading for engineers and researchers Cover Title Page Copyright Contents Preface About the Authors Chapter 1 LEDs for Solid‐State Lighting 1.1 Introduction 1.2 Evolution of Light Sources and Lighting Systems 1.3 Historical Development of LEDs 1.4 Implementation of White Light Illumination with an LED 1.5 LEDs for General Lighting References Chapter 2 Packaging of LED Chips 2.1 Introduction 2.2 Overall Packaging Process and LED Package Types 2.2.1 PTH LED Component 2.2.2 SMD LED Component 2.3 Chip Mounting and Interconnection 2.3.1 Die Attach Adhesive 2.3.2 Soldering and Eutectic Bonding 2.3.3 Wire Bonding 2.3.4 Flip‐Chips 2.4 Phosphor Coating and Dispensing Process 2.4.1 Dispersed Dispensing 2.4.2 Conformal Coating 2.4.3 Remote Phosphor 2.5 Encapsulation and Molding Process 2.5.1 Encapsulant Filling with Lens 2.5.2 Lens Molding 2.6 Secondary Optics and Lens Design References Chapter 3 Chip Scale and Wafer Level Packaging of LEDs 3.1 Introduction 3.2 Chip Scale Packaging 3.3 Enabling Technologies for Wafer Level Packaging 3.3.1 Photolithography 3.3.2 Wafer Etching 3.3.3 TSV Filling 3.3.4 Bond Pad Metallization 3.3.5 Wafer Level Phosphor Deposition Methods 3.3.5.1 Wafer Level Phosphor Stencil Printing 3.3.5.2 Waffle Pack Remote Phosphor Film 3.3.5.3 Remote Phosphor Dispensing on a Pre‐Encapsulated Silicone Lens 3.3.6 Moldless Encapsulation 3.4 Designs and Structures of LED Wafer Level Packaging 3.4.1 Reflective Layer Design 3.4.2 Cavity and Reflective Cup by Wet Etching 3.4.3 Copper‐Filled TSVs for Vertical Interconnection and Heat Dissipation 3.5 Processes of LED Wafer Level Packaging 3.5.1 Case 1: Multichip LED WLP with Through Silicon Slots 3.5.2 Case 2: LED WLP with a Cavity 3.5.3 Case 3: Applications of an LED WLP Panel References Chapter 4 Board Level Assemblies and LED Modules 4.1 Introduction 4.2 Board Level Assembly Processes 4.2.1 Metal Core Printed Circuit Board 4.2.2 Printed Circuit Board with Thermal Vias 4.2.3 Wave Soldering 4.2.4 Surface Mount Reflow 4.3 Chip‐on‐Board Assemblies 4.4 LED Modules and Considerations References Chapter 5 Optical, Electrical, and Thermal Performance 5.1 Evaluation of Optical Performance 5.1.1 Basic Concepts of Radiometric and Photometric 5.1.2 Irradiance Measurement Calibration 5.1.3 Common Measurement Equipment 5.2 Power Supply and Efficiency 5.2.1 Electrical Characteristics of LED 5.2.2 Power Supply for LEDs 5.2.3 Power Efficiency 5.3 Consideration of LED Thermal Performance 5.3.1 Thermal Characterization Methods for LEDs 5.3.2 Thermal Management Methods References Chapter 6 Reliability Engineering for LED Packaging 6.1 Concept of Reliability and Test Methods 6.1.1 Reliability of Electronic Components or Systems 6.1.2 Common Failure Mechanisms and Reliability Tests 6.2 Failure Analysis and Life Assessment 6.2.1 Methodology for Failure Analysis 6.2.2 Weibull Analysis and Acceleration Model for Life Assessment 6.3 Design for Reliability References Chapter 7 Emerging Applications of LEDs 7.1 LEDs for Automotive Lighting 7.1.1 Development 7.1.2 Typical Structures 7.1.3 Challenges 7.1.3.1 Electric Driver 7.1.3.2 Optical Design 7.1.3.3 Thermal Optimization 7.1.4 Conclusion 7.2 Micro‐ and Mini‐LED Display 7.2.1 Development 7.2.1.1 Development of Mini‐LED Display 7.2.1.2 Development of Micro‐LED Displays 7.2.2 Typical Structures 7.2.3 Challenges 7.2.4 Conclusion 7.3 LED for Visible Light Communication 7.3.1 Development 7.3.2 Typical Applications 7.3.2.1 Li‐Fi 7.3.2.2 Traffic Communication 7.3.2.3 Smart City 7.3.3 Challenges 7.3.3.1 Multiple Input and Multiple Output (MIMO) 7.3.3.2 Reliability and Network Coverage 7.3.3.3 Other Challenges 7.3.4 Conclusion References Chapter 8 LEDs Beyond Visible Light 8.1 Applications of UV‐LED 8.1.1 Structures 8.1.1.1 UV‐LED Chip 8.1.1.2 UV‐LED Package 8.1.2 Applications 8.1.2.1 Sterilization and Disinfection 8.1.2.2 Curing 8.1.2.3 UV Communications Technology 8.1.2.4 White Light Generation 8.1.2.5 Medical Treatment 8.1.3 Challenges 8.1.3.1 Heteroepitaxy of DUV‐LEDs 8.1.3.2 Doping of AlGaN UV‐LEDs and External Quantum Efficiency 8.1.3.3 Thermal Degradation 8.1.3.4 Structures of UV‐LED Packages 8.1.3.5 Materials of UV‐LED Packages 8.1.4 Conclusion 8.2 Applications of IR‐LEDs 8.2.1 Structures 8.2.2 Applications 8.2.2.1 Sensors and Detecting 8.2.2.2 Imaging Techniques 8.2.2.3 Biomedical Engineering 8.2.3 Challenges 8.2.3.1 Monolithic Integration 8.2.3.2 Driving Currents and Efficiency 8.2.3.3 Thermal Management 8.2.4 Conclusion 8.3 Future Outlook and Other Technology Trends 8.3.1 Better Light Sources 8.3.1.1 Display Technology 8.3.1.2 High‐Quality Light 8.3.1.3 Special Light Sources 8.3.2 Interconnection 8.3.3 Interaction with Humans 8.3.4 Light on Demand References Index EULA