ENGLISH

System on Package: Miniaturization of the Entire System

By Rao Tummala

Book information

Year
2008
ISBN
0071459065, 9780071459068, 9780071593328
DOI
10.1036/0071459065
LCC
TK7870.15 .T86 2008
Open Library ID
OL18725064M
Language
english
Format
PDF
Filesize
15 MB (15416806 bytes)
Edition
1
Pages
785\807
Scanned
yes
Time added
2011-06-04 13:46:07

Description

System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

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