ENGLISH

Failure Analysis of Integrated Circuits: Tools and Techniques

By Lawrence C. Wagner (auth.) , Lawrence C. Wagner Ph.D. (eds.)

Book information

Publisher
Springer US
Year
1999
ISBN
978-1-4613-7231-8, 978-1-4615-4919-2
DOI
10.1007/978-1-4615-4919-2
Language
english
Format
PDF
Filesize
21 MB (21529801 bytes)
Series
The Springer International Series in Engineering and Computer Science 494
Edition
1
Pages
255\255
Orientation
yes
Scanned
yes
Time added
2013-08-01 04:00:00
Optical and Electronic Materials; Electrical Engin

Description

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

Similar books