Design and Development of MEMS based Guided Beam Type Piezoelectric Energy Harvester (Energy Systems in Electrical Engineering)

Description

This book presents device design, layout design, FEM analysis, device fabrication, and packaging and testing of MEMS-based piezoelectric vibration energy harvesters. It serves as a complete guide from design, FEM, and fabrication to characterization. Each chapter of this volume illustrates key insight technologies through images. The book showcases different technologies for energy harvesting and the importance of energy harvesting in wireless sensor networks. The design, simulation, and comparison of three types of structures – single beam cantilever structure, cantilever array structure, and guided beam structure have also been reported in one of the chapters. In this volume, an elaborate characterization of two-beam and four-beam fabricated devices has been carried out. This characterization includes structural, material, morphological, topological, dynamic, and electrical characterization of the device. The volume is very concise, easy to understand, and contains colored images to understand the details of each process. Foreword Preface Acknowledgements Contents About the Authors Abbreviations Symbols 1 Introduction 1.1 Introduction 1.2 Energy Requirement in WSNs 1.3 Energy Harvesting for WSNs—State of the Art 1.4 Vibration-Based Energy Harvesters 1.5 Motivation 1.6 Overview of Monograph References 2 Piezoelectric Vibration Energy Harvesters: A Review 2.1 Discussion and Planning References 3 Design, Modeling and Comparison of Piezoelectric Vibration Energy Harvesters 3.1 Single-Beam Cantilever-Type P-VEH 3.2 Cantilever Generator Array 3.3 Clamped–Clamped or Guided Beam Structures 3.4 Comparison 3.5 Effect of Shape of Seismic Mass on Potential Generated by Piezoelectric Energy Harvester 3.6 Simulation of Different Geometries of Seismic Mass 3.7 Discussion 3.8 Effect of Piezoelectric Material on Guided Beam Piezoelectric Energy Harvester References 4 Design and FEM Simulation of Guided Beam Piezoelectric Energy Harvester 4.1 Design of Guided Four-Beam P-VEH 4.2 FEM Analysis of Guided Four-Beam P-VEH 4.2.1 Resonance Frequency 4.2.2 Displacement 4.2.3 von Mises Stress 4.2.4 Electric Potential 4.2.5 Selection of Seismic Mass 4.3 Comparison of Guided Two-Beam and Four-Beam Piezoelectric Energy Harvester 4.3.1 Design, FEM and Comparison of Guided Two-Beam and Four-Beam Piezoelectric Energy Harvester 4.3.2 Resonance Frequency 4.3.3 Displacement 4.3.4 von Mises Stress 4.3.5 Electric Potential 4.4 Design and Optimization of Split Electrodes for Guided Beam Piezoelectric Energy Harvester 4.4.1 Effect of Length of Split Electrode on Resonance Frequency 4.4.2 Effect of Length of Split Electrode on Change in Capacitance References 5 Fabrication of Guided Beam Piezoelectric Energy Harvester 5.1 Introduction 5.1.1 Fabrication Methodology 5.2 Design of Mask Layouts 5.2.1 Mask #1:TMAH Etch Mask for Pyramidal-Shaped Seismic Mass 5.2.2 Mask #2: Bottom Electrode Patterning 5.2.3 Mask #3: Piezoelectric Layer Patterning 5.2.4 Mask #4: Top Electrode Patterning 5.2.5 Mask #5: DRIE Etch 5.3 Fabrication of Guided Beam Piezoelectric Energy Harvester 5.3.1 Device Fabrication Flow 5.3.2 Device Fabrication (Batch 1) 5.4 Detailed Unit Processes 5.4.1 Cleaning 5.4.2 Thermal Oxidation and LPCVD Nitride 5.4.3 Lithography (Mask #1) for Pyramidal-Shaped Seismic Mass 5.4.4 Reactive Ion Etching (RIE) for Oxide and Nitride Etch 5.4.5 Bulk Micromachining of Silicon for Pyramidal-Shaped Seismic Mass 5.4.6 Gold Sputtering and Bottom Electrode Patterning (Mask #2) 5.4.7 Piezoelectric Layer (Zinc Oxide) Sputtering and Patterning (Mask #3) 5.4.8 Gold Sputtering and Top Electrode Patterning (Mask #4) 5.4.9 Lithography Mask #5 and Beam Release Using DRIE 5.4.10 Dicing and Device Release 5.5 Fabrication Process Optimization and Device Fabrication (Batch 2) 5.5.1 Fabrication Flow 5.5.2 Fabrication of Structure on Front Side of Wafer 5.5.3 Bulk Micromachining of Silicon for Pyramidal-Shaped Seismic Mass 5.5.4 Guided Beam Release and Thinning Using Deep Reactive Ion Etching (DRIE) 5.5.5 Dicing and Device Release 5.6 Design of the PCB and Packaging References 6 Testing and Characterization of Guided Beam Piezoelectric Energy Harvester 6.1 Structural Characterization 6.2 Dynamic Characterization Using Laser Doppler Vibrometer (Batch1 Devices) 6.2.1 LDV Measurement for Guided Two-Beam Piezoelectric Energy Harvester 6.2.2 LDV Measurement for Guided Four-Beam Piezoelectric Energy Harvester 6.3 Dynamic Characterization using LDV (Batch 2 Devices) 6.3.1 LDV Measurement for Guided Two-Beam Device 6.3.2 LDV Measurement for Guided Four-Beam Device 6.4 Static Capacitance Measurement and Device Packaging 6.5 Vibration Shaker Test 6.5.1 Output Voltage/Power Versus Input Acceleration 6.5.2 Output Voltage Versus Frequency References 7 Design of MEMS-Based Piezoelectric Energy Harvester for Low-Frequency Applications 7.1 Low-Frequency Vibration Energy Harvesting 7.2 Design of Cantilever Type P-VEH 7.3 Effect of Length and Thickness of Piezoelectric Layer on Cantilever Type P-VEH 7.3.1 Displacement 7.3.2 von Mises Stress 7.3.3 Electric Potential 7.4 Effect of Length and Thickness of Beam on Cantilever Type P-VEH 7.4.1 Displacement 7.4.2 von Mises Stress 7.4.3 Electric Potential