ENGLISH

Interconnects in VLSI Design

By J. M. Wang , E. S. Kuh (auth.) , Hartmut Grabinski (eds.)

Book information

Publisher
Springer US
Year
2000
ISBN
978-1-4613-6954-7, 978-1-4615-4349-7
DOI
10.1007/978-1-4615-4349-7
Language
english
Format
PDF
Filesize
19 MB (20314874 bytes)
Edition
1
Pages
236\233
Orientation
yes
Scanned
yes
Time added
2013-08-01 04:00:00
CAE) and DesignCircuits and Systems; Electrical Engineering; Comp

Description

This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua­ tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des­ cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.

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