ENGLISH

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

By Erdogan Madenci , Ibrahim Guven , Bahattin Kilic (auth.)

Book information

Publisher
Springer US
Year
2003
ISBN
978-1-4613-4989-1, 978-1-4615-0255-5
DOI
10.1007/978-1-4615-0255-5
Language
english
Format
PDF
Filesize
8 MB (8183448 bytes)
Series
The Springer International Series in Engineering and Computer Science 719
Edition
1
Pages
185\200
Orientation
yes
Scanned
yes
Time added
2013-08-01 04:00:00
MachinesManufacturingTools; Optical and Electronic Materials; Electrica

Description

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

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