ENGLISH

Electrothermal Analysis of VLSI Systems

By Yi-Kan Cheng , Ching-Han Tsai , Chin-Chi Teng , Sung-Mo Steve Kang (auth.)

Book information

Publisher
Springer US
Year
2002
ISBN
978-0-7923-7861-7, 978-0-306-47024-0
DOI
10.1007/b117332
Language
english
Format
PDF
Filesize
7 MB (7638046 bytes)
Edition
1
Pages
210\217
Orientation
yes
Scanned
yes
Time added
2013-08-01 04:00:00
Circuits and Systems; Electronic and Computer Engi

Description

Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration). Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis. Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

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