ENGLISH

Packaging of High Power Semiconductor Lasers

By Wei Zhao , Hui Liu (auth.) , Xingsheng Liu , Lingling Xiong

Book information

Publisher
Springer-Verlag New York
Year
2015
ISBN
978-1-4614-9262-7, 978-1-4614-9263-4
DOI
10.1007/978-1-4614-9263-4
Language
english
Format
PDF
Filesize
23 MB (24016862 bytes)
Series
Micro- and Opto-Electronic Materials, Structures, and Systems
Edition
1
Pages
402\415
Time added
2014-11-10 20:00:00
Energy Systems

Description

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

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