ENGLISH

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

By Tetsuya Osaka , Y. Shacham-Diamand (auth.) , Yosi Shacham-Diamand , Madhav Datta , Takayuki Ohba (eds.)

Book information

Publisher
Springer-Verlag New York
Year
2009
ISBN
0387958673, 9780387958675, 9780387958682
DOI
10.1007/978-0-387-95868-2
Language
english
Format
PDF
Filesize
24 MB (24671381 bytes)
Edition
1
Pages
552\533
Library
duansci.com
Time added
2010-05-31 15:29:46
Electrochemistry; Materials Sciencegeneral; Industrial Chemistry/Chemical Engineering

Description

Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization. It describes the materials used, their properties, and the way they are all integrated, specifically in regard to the copper integration processes and electrochemical processes in the nanoscale regime. The book also presents various novel nanoscale technologies that will link modern nanoscale electronics to future nanoscale based systems. This diverse, multidisciplinary volume will appeal to process engineers in the microelectronics industry; universities with programs in ULSI design, microelectronics, MEMS and nanoelectronics; and professionals in the electrochemical industry working with materials, plating and tool vendors.

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