ENGLISH

Electronics Production Defects and Analysis

By Oommen Tharakan Kuttiyil Thomas , Padma Padmanabhan Gopalan

Book information

Publisher
Springer
Year
2022
ISBN
9811698236, 9789811698231
Language
english
Format
PDF
Filesize
11 MB (11966501 bytes)
Series
Springer Tracts in Electrical and Electronics Engineering)
Pages
154\155
Time added
2022-11-09 13:53:46

Description

This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students. Foreword Preface The Book The Purpose Book Outline Acknowledgements Contents About the Authors Abbreviations 1 Introduction 1.1 Organization of the Book Reference 2 Soldering Defects 2.1 Introduction 2.2 Importance of Soldering 2.3 Soldering Process 2.4 Wetting and Dihedral Angle 2.5 Solder Paste 2.5.1 General Flux Formulations 2.6 Reflow Profile 2.7 Guidelines for Production Flow of Electronic Packages 2.8 Soldering Defects 2.8.1 Group 1: Dewetting 2.8.2 Group 2: Demarcation 2.8.3 Group 3: Solder Bridging 2.8.4 Group 4: Excess Solder 2.8.5 Group 5: Overheated Joint 2.8.6 Group 6: Improper Solder Filleting 2.8.7 Group 7: Solder Starved 2.8.8 Group 8: Flux Residue 2.8.9 Group 9: Peel off 2.8.10 Group 10:  Solder Balls 2.8.11 Group 11: Solder Bump 2.8.12 Group 12: Offset in Soldering 2.8.13 Group 13: Blow Hole 2.8.14 Group 14: Cold Joint 2.8.15 Group 15: Solder Spreading 2.8.16 Group 16: Fractured Solder Joint 2.8.17 Group 17: Overhang 2.8.18 Group 18: Multiple Soldering 2.8.19 Group 19: Component Tilt 2.8.20 Group 20: Poor Solder 2.8.21 Group 21: Solder Miss 2.8.22 Group 22: Open Joint References 3 PCB Defects 3.1 Introduction 3.2 PCB Materials 3.3 Quality Control of PCBs 3.3.1 PCB Qualification and Evaluation 3.3.2 Microsection 3.4 PCB Defects 3.4.1 Group 1: White Spots 3.4.2 Group 2: Damage 3.4.3 Group 3: Solder Mask Defects 3.4.4 Group 4: Void 3.4.5 Group 5: Plating Related 3.4.6 Group 6: Annular Ring 3.4.7 Group 7: Copper Visibility 3.4.8 Group 8: Foreign Particles 3.4.9 Group 9: Corrosion 3.4.10 Group 10: Non-wetting 3.4.11 Group 11: Measling 3.4.12 Group 12: Haloing 3.4.13 Group 13: Dull Appearance 3.4.14 Group 14: Pad Lift 3.4.15 Group 15: Grooves in Drill Hole 3.4.16 Group 16: Interface Separation 3.4.17 Group 17: Track Width Reduction 3.4.18 Group 18: Cut References 4 Mounting Defects 4.1 Introduction 4.2 Mounting Defects Reference 5 Conformal Coating and Potting Defects 5.1 Introduction 5.2 Commonly Used Materials and Applications 5.3 Basic Requirements 5.4 Defects References 6 EEE Component Defects 6.1 Introduction 6.2 Defects References 7 Workmanship Defects 7.1 Introduction 7.2 Defects Reference 8 Defects Due to the Usage of Non-FFF Components 8.1 Introduction 8.2 Defects Reference 9 Defects in CAD Layout 9.1 Introduction 9.2 Defects Reference

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