Introduction to Microfabrication, Second Edition
Book information
Description
This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered. This second edition includes: expanded sections on MEMS and microfluidics related fabrication issues new chapters on polymer and glass microprocessing, as well as serial processing techniques 200 completely new and 200 modified figures more coverage of imprinting techniques, process integration and economics of microfabrication 300 homework exercises including conceptual thinking assignments, order of magnitude estimates, standard calculations, and device design and process analysis problems solutions to homework problems on the complementary website, as well as PDF slides of the figures and tables within the book With clear sections separating basic principles from more advanced material, this is a valuable textbook for senior undergraduate and beginning graduate students wanting to understand the fundamentals of microfabrication. The book also serves as a handy desk reference for practicing electrical engineers, materials scientists, chemists and physicists alike. www.wiley.com/go/Franssila_Micro2eContent: Chapter 1 Introduction (pages 1–13): Chapter 2 Micrometrology and Materials Characterization (pages 15–27): Chapter 3 Simulation of Microfabrication Processes (pages 29–34): Chapter 4 Silicon (pages 35–46): Chapter 5 Thin?Film Materials and Processes (pages 47–67): Chapter 6 Epitaxy (pages 69–76): Chapter 7 Advanced Thin Films (pages 77–92): Chapter 8 Pattern Generation (pages 93–101): Chapter 9 Optical Lithography (pages 103–113): Chapter 10 Advanced Lithography (pages 115–126): Chapter 11 Etching (pages 127–141): Chapter 12 Wafer Cleaning and Surface Preparation (pages 143–152): Chapter 13 Thermal Oxidation (pages 153–163): Chapter 14 Diffusion (pages 165–172): Chapter 15 Ion Implantation (pages 173–180): Chapter 16 CMP: Chemical–Mechanical Polishing (pages 181–189): Chapter 17 Bonding (pages 191–201): Chapter 18 Polymer Microprocessing (pages 203–223): Chapter 19 Glass Microprocessing (pages 225–235): Chapter 20 Anisotropic Wet Etching (pages 237–254): Chapter 21 Deep Reactive Ion Etching (pages 255–270): Chapter 22 Wafer Engineering (pages 271–282): Chapter 23 Special Processes and Materials (pages 283–297): Chapter 24 Serial Microprocessing (pages 299–311): Chapter 25 Process Integration (pages 313–328): Chapter 26 MOS Transistor Fabrication (pages 329–345): Chapter 27 Bipolar Transistors (pages 347–355): Chapter 28 Multilevel Metallization (pages 357–367): Chapter 29 Surface Micromachining (pages 369–385): Chapter 30 MEMS Process Integration (pages 387–407): Chapter 31 Process Equipment (pages 409–417): Chapter 32 Equipment for Hot Processes (pages 419–424): Chapter 33 Vacuum and Plasmas (pages 425–432): Chapter 34 CVD and Epitaxy Equipment (pages 433–440): Chapter 35 Cleanrooms (pages 441–447): Chapter 36 Yield and Reliability (pages 449–456): Chapter 37 Economics of Microfabrication (pages 457–468): Chapter 38 Moore's Law and Scaling Trends (pages 469–483): Chapter 39 Microfabrication at Large (pages 485–497):
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