Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling

Description

A total revision of the author’s previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors. The beginning of this book is largely devoted to prediction of airflow and well-mixed air temperatures in systems and heat sinks, after which it explores convective heat transfer from heat sinks, circuit boards, and components. Applying a systematic presentation of information to enhance understanding and computational practice, this book: Provides complete mathematical derivations and supplements formulae with design plots Offers complete exercise solutions (Mathcad™ worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book Addresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction Presents mathematical descriptions of large thermal network problem formulation Discusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problems This reference is useful as a professional resource and also ideal for use in a complete course on the subject of electronics cooling, with its suggested course schedule and other helpful advice for instructors. Selected sections may be used as application examples in a traditional heat transfer course or to help professionals improve practical computational applications. Front Cover Title Page © 2011 by Taylor and Francis Group, LLC Contents Preface About the Author 1 Introduction 2 Thermodynamics of Airflow 3 Airflow I: Forced Flow in Systems 4 Airflow II: Forced Flow in Ducts, Extrusions, and Pin Fin Arrays 5 Airflow III: Buoyancy Driven Draft 6 Forced Convective Heat Transfer I: Components 7 Forced Convective Heat Transfer II: Ducts, Extrusions, and Pin Fin Arrays 8 Natural Convection Heat Transfer I: Plates 9 Natural Convection Heat Transfer II: Heat Sinks 10 Thermal Radiation Heat Transfer 11 Conduction I: Basics 12 Conduction II: Spreading Resistance 13 Additional Mathematical Methods APPENDIX i Supplemental Exercises APPENDIX ii Physical Properties of Dry Air at Atmospheric Pressure APPENDIX iii Radiation Emissivity at Room Temperature Assembled from Numerous Sources APPENDIX iv Solution Details for U-Channel Radiation Network Equations APPENDIX v Thermal Conductivity of Some Common Electronic Packaging Materials at Room Temperature: Values Are From Several Miscellaneous Sources APPENDIX vi Some Properties of Bessel Functions APPENDIX vii Some Properties of the Dirac Delta Function APPENDIX viii Fourier Coefficients for a Rectangular Source APPENDIX ix Derivation of the Green’s Function Properties for the Spreading Problem of a Rectangular Source and Substrate - Method A APPENDIX x Derivation of the Green’s Function Properties for the Spreading Problem of a Rectangular Source and Substrate - Method B APPENDIX xi Proof of the Steady-State Green’s Function Reciprocity APPENDIX xii Nonspreading Problems - Unequal Ambients APPENDIX xiii Finned Surface to Flat Plate h Conversion APPENDIX xiv Extending the Single-Source Problem to Multiple Sources and Resistances APPENDIX xv Some Conversion Factors Bibliography Index