Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers
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Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing. Contents Preface Acknowledgement Part I: From Crystal to Prime Wafers 1 Wafers and Semiconductors 2 Wafer Manufacturing: Generalized Processes and Flow 3 Process Modeling and Manufacturing Processes Part II: Wafer Forming 4 Wafer Slicing Using a Modern Slurry Wiresaw and Other Saws 5 Modeling of the Wiresaw Manufacturing Process and Material Characteristics 6 Diamond-Impregnated Wire Saws and the Sawing Process Part III: Wafer Surface Preparation and Management 7 Lapping 8 Chemical Mechanical Polishing 9 Grinding, Edge Grinding, Etching, and Surface Cleaning 10 Wafer Metrology and Optical Techniques 11 Conclusion Index
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