ENGLISH

3D IC Devices, Technologies, and Manufacturing

By Hong Xiao

Book information

Publisher
SPIE Press
Year
2016
ISBN
1510601465, 9781510601468
Language
english
Format
PDF
Filesize
38 MB (39665124 bytes)
Series
SPIE Press Monographs
Pages
220\200
Scanned
yes
Time added
2017-05-16 23:50:38
Integrated;Circuits;Electrical & Electronics;EnginUsed & Rental Textbooks;Business & Finance;Communi

Description

The process of scaling integrated circuit (IC) chips has become more challenging as the feature size has been pushed into nanometer-technology nodes. In order to extend the scaling, engineers and scientists have attempted to not only shrink the feature size in x and y directions but also push IC devices into the third dimension. This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging.

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